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Copper Clad Laminate Paper Phenolic Sheet XPC FR1 for PCB Processing
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Copper Clad Laminate Paper Phenolic Sheet XPC FR1 for PCB Processing

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We can offer a variety of packaging options and produce products according to the customer's OEM specifications, including different sizes such as buckets and bottles, as well as varying weights.

Rated Voltage33KVTypeInsulation Sheet
MaterialFiberglassApplicationElectronics Device
Thickness0.8-1.6mmColorBrown
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