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701AB Fast Curing Epoxy Resin for Metal Bonding Electronics Adhesive Hard Materials Mold Casting Potting Insulation
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701AB Fast Curing Epoxy Resin for Metal Bonding Electronics Adhesive Hard Materials Mold Casting Potting Insulation

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We can offer a variety of packaging options and produce products according to the customer's OEM specifications, including different sizes such as buckets and bottles, as well as varying weights.

ClassificationDouble Components AdhesivesMain Raw MaterialEpoxy Resin
EINECS No.N/ACAS No.N/A
MFMixtureOther NamesHard Material Bonding Resin
TypeClear Hard Epoxy AB ResinProduct nameClear Hard Epoxy Resin
AppearanceColorless Transparent LiquidColorColorless Transparent
Initial Cure5 min at Room TemperatureFinal Cure10 min at Room Temperature
Shore HardnessShore D 85Curing MethodRoom Temperature or Heat Curing
Shelf Life12 Months in Original Package
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